|
Total properties:
31
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|
|
|
Patent #:
|
|
Issue Dt:
|
11/29/2022
|
Application #:
|
16972608
|
Filing Dt:
|
12/07/2020
|
|
Publication #:
|
|
Pub Dt:
|
07/29/2021
| | | | |
|
Title:
|
RESIN GEAR AND RESIN GEAR MANUFACTURING METHOD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2022
|
Application #:
|
16972609
|
Filing Dt:
|
12/07/2020
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|
Publication #:
|
|
Pub Dt:
|
07/29/2021
| | | | |
|
Title:
|
RESIN-MADE GEAR
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17044328
|
Filing Dt:
|
10/01/2020
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|
Publication #:
|
|
Pub Dt:
|
01/28/2021
| | | | |
|
Title:
|
RESIN MEMBER, METHOD FOR PRODUCING RESIN MEMBER AND HEAT STORAGE BODY
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17047391
|
Filing Dt:
|
10/14/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2021
| | | | |
|
Title:
|
METHOD FOR SUPPRESSING CORROSION UNDER HEAT-INSULATING MATERIAL, AND PASTE FOR SUPPRESSING CORROSION UNDER HEAT-INSULATING MATERIAL
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/25/2023
|
Application #:
|
17258747
|
Filing Dt:
|
01/08/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/02/2021
| | | | |
|
Title:
|
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, HEAT-CURABLE RESIN COMPOSITION, AND DICING-DIE ATTACH FILM
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/24/2023
|
Application #:
|
17267023
|
Filing Dt:
|
02/09/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17288913
|
Filing Dt:
|
04/27/2021
|
|
Publication #:
|
|
Pub Dt:
|
12/23/2021
| | | | |
|
Title:
|
TEMPORARY PROTECTIVE FILM FOR PRODUCING SEMICONDUCTOR DEVICE, REEL BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17296547
|
Filing Dt:
|
05/25/2021
|
|
Publication #:
|
|
Pub Dt:
|
01/27/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPORARY FIXATION MATERIAL
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17297457
|
Filing Dt:
|
05/27/2021
|
|
Publication #:
|
|
Pub Dt:
|
12/23/2021
| | | | |
|
Title:
|
LAMINATED GLASS FOR VEHICLE
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17414954
|
Filing Dt:
|
06/17/2021
|
|
Publication #:
|
|
Pub Dt:
|
02/24/2022
| | | | |
|
Title:
|
RESIN COMPOSITION FOR TEMPORARY FIXING USE, RESIN FILM FOR TEMPORARY FIXING USE, SHEET FOR TEMPORARY FIXING USE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17438943
|
Filing Dt:
|
09/14/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFACTURING SAME
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17439400
|
Filing Dt:
|
09/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17439402
|
Filing Dt:
|
09/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/19/2024
|
Application #:
|
17439404
|
Filing Dt:
|
09/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2022
| | | | |
|
Title:
|
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE, METHOD FOR MANUFACTURING SUPPORT PIECE, AND LAMINATED FILM
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17598877
|
Filing Dt:
|
09/28/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2022
| | | | |
|
Title:
|
CATALYST FOR AIR ELECTRODES, AIR ELECTRODE AND METAL AIR SECONDARY BATTERY
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17601710
|
Filing Dt:
|
10/06/2021
|
|
Publication #:
|
|
Pub Dt:
|
06/23/2022
| | | | |
|
Title:
|
COMPOSITE MATERIAL, SHEET, AND HEAT INSULATOR
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17602276
|
Filing Dt:
|
10/07/2021
|
|
Publication #:
|
|
Pub Dt:
|
05/26/2022
| | | | |
|
Title:
|
SOUND-ABSORBING MATERIAL
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17609403
|
Filing Dt:
|
11/08/2021
|
|
Publication #:
|
|
Pub Dt:
|
07/07/2022
| | | | |
|
Title:
|
METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17609404
|
Filing Dt:
|
11/08/2021
|
|
Publication #:
|
|
Pub Dt:
|
07/14/2022
| | | | |
|
Title:
|
ADSORBENT PARTICLES, METHOD FOR PRODUCING ADSORBENT PARTICLES, BASE MATERIAL PARTICLES, FILLING COLUMN AND METHOD FOR RECOVERING RARE EARTH ELEMENT
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17612224
|
Filing Dt:
|
11/18/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/06/2022
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17613933
|
Filing Dt:
|
11/23/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/06/2022
| | | | |
|
Title:
|
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, LEAD FRAME WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATION MOLDED BODY WITH TEMPORARY PROTECTIVE FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17617938
|
Filing Dt:
|
12/10/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/29/2022
| | | | |
|
Title:
|
ADSORBENT PARTICLES, BASE PARTICLE, PACKED COLUMN, AND METHOD FOR RECOVERING RARE-EARTH ELEMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2024
|
Application #:
|
17619307
|
Filing Dt:
|
12/15/2021
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2022
| | | | |
|
Title:
|
USER DEVICE AND CASE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17624846
|
Filing Dt:
|
01/05/2022
|
|
Publication #:
|
|
Pub Dt:
|
08/25/2022
| | | | |
|
Title:
|
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17633211
|
Filing Dt:
|
02/07/2022
|
|
Publication #:
|
|
Pub Dt:
|
09/15/2022
| | | | |
|
Title:
|
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17639914
|
Filing Dt:
|
03/03/2022
|
|
Publication #:
|
|
Pub Dt:
|
10/20/2022
| | | | |
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17641101
|
Filing Dt:
|
03/08/2022
|
|
Publication #:
|
|
Pub Dt:
|
09/08/2022
| | | | |
|
Title:
|
TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY, TEMPORARY PROTECTIVE BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17760303
|
Filing Dt:
|
11/01/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/23/2023
| | | | |
|
Title:
|
CONDUCTIVE ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17764202
|
Filing Dt:
|
03/28/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/03/2022
| | | | |
|
Title:
|
ADHESIVE FOR SEMICONDUCTOR, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17766732
|
Filing Dt:
|
04/06/2022
|
|
Publication #:
|
|
Pub Dt:
|
07/27/2023
| | | | |
|
Title:
|
ELECTROCHEMICAL SENSOR
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17770627
|
Filing Dt:
|
04/21/2022
|
|
Publication #:
|
|
Pub Dt:
|
09/15/2022
| | | | |
|
Title:
|
RESIN COMPOSITION FOR TEMPORARY FIXATION, SUBSTRATE-CONVEYING SUPPORT TAPE, AND ELECTRONIC EQUIPMENT DEVICE MANUFACTURING METHOD
|
|
