Patent Assignment Details
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| Reel/Frame: | 063323/0947 | |
| Pages: | 10 |
| | Recorded: | 04/14/2023 | | |
| Attorney Dkt #: | 20277-156321-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18013870
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Filing Dt:
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12/29/2022
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Publication #:
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Pub Dt:
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04/11/2024
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Title:
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COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, COMPOSITION FOR OPTICAL MEMBER FORMATION, RESIN FOR UNDERLAYER FILM FORMATION, RESIST RESIN, RADIATION-SENSITIVE RESIN, AND RESIN FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY
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Assignee
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8324 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY LLP
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120 SOUTH LASALLE STREET
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SUITE 2100
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CHICAGO, IL 60603
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