Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064067/0988 | |
| Pages: | 6 |
| | Recorded: | 05/02/2023 | | |
| Attorney Dkt #: | 224114 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND INVENTOR'S EXECUTION DATE PREVIOUSLY RECORDED ON REEL 063267 FRAME 0899. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18029481
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Filing Dt:
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03/30/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Title:
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CURABLE RESIN COMPOSITION FOR SILICON-CONTAINING RESIST, PATTERN FORMING METHOD, METHOD FOR PRODUCING IMPRINT MOLD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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Assignee
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| 1-1 ICHIGAYA-KAGACHO 1-CHOME, SHINJUKU-KU |
| TOKYO-TO, JAPAN 162-8001 |
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Correspondence name and address
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JOHN A. RADI
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OLIFF PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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