Patent Assignment Details
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Reel/Frame: | 064368/0779 | |
| Pages: | 3 |
| | Recorded: | 07/25/2023 | | |
Attorney Dkt #: | 10024.0002 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/20/2018
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Application #:
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15388927
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Filing Dt:
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12/22/2016
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Publication #:
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Pub Dt:
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04/13/2017
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Title:
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LEVELING COMPOSITION AND METHOD FOR ELECTRODEPOSITION OF METALS IN MICROELECTRONICS
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Assignee
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2358 CHANGAN ROAD |
BUILDING #9, FIRST FLOOR |
WUJIANG, CHINA 215200 |
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Correspondence name and address
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SZDC LAW P.C.
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1629 K STREET NW, SUITE 300
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WASHINGTON, DC 20006
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05/17/2024 02:29 PM
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