Patent Assignment Details
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| Reel/Frame: | 064653/0287 | |
| Pages: | 6 |
| | Recorded: | 08/21/2023 | | |
| Attorney Dkt #: | TSU11102P00170US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18023185
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Filing Dt:
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02/24/2023
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Publication #:
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Pub Dt:
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10/26/2023
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Title:
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COMPOUND SEMICONDUCTOR SUBSTRATE AND COMPOUND SEMICONDUCTOR DEVICE
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Assignee
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| 12-8, MINAMI SEMBA 2-CHOME |
| CHUO-KU, OSAKA-SHI, OSAKA, JAPAN 5420081 |
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Correspondence name and address
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WOOD, PHILLIPS, KATZ, CLARK & MORTIMER
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500 W. MADISON STREET
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SUITE 1130
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CHICAGO, IL 60661-2562
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