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Reel/Frame:065370/0396   Pages: 3
Recorded: 10/27/2023
Attorney Dkt #:AI-427NPC9
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18496069
Filing Dt:
10/27/2023
Publication #:
Pub Dt:
02/15/2024
Title:
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP CHIP MANNER
Assignors
1
Exec Dt:
03/11/2013
2
Exec Dt:
03/11/2013
Assignee
1
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI
KYOTO, JAPAN 615-8585
Correspondence name and address
RABIN & BERDO, P.C.
2650 PARK TOWER DRIVE, SUITE 800
VIENNA, VA 22180

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