Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 066327/0476 | |
| Pages: | 4 |
| | Recorded: | 02/01/2024 | | |
| Attorney Dkt #: | YPL2382US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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16898761
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Filing Dt:
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06/11/2020
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Publication #:
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Pub Dt:
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05/20/2021
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Title:
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HIGH-THERMAL CONDUCTIVE EPOXY COMPOUND AND COMPOSITION, MATERIAL FOR SEMICONDUCTOR PACKAGE, MOLDED PRODUCT, ELECTRIC AND ELECTRONIC DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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CANTOR COLBURN LLP
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20 CHURCH STREET
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HARTFORD, CT 06103
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05/18/2024 02:31 PM
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