Patent Assignment Details
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Reel/Frame: | 066444/0854 | |
| Pages: | 5 |
| | Recorded: | 02/12/2024 | | |
Attorney Dkt #: | T93129US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/26/2024
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Application #:
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17515234
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Filing Dt:
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10/29/2021
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Publication #:
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Pub Dt:
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05/04/2023
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Title:
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SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT
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Assignee
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12500 TI BOULEVARD |
M/S 3999 |
DALLAS, TEXAS 75243 |
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Correspondence name and address
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RICHANDA DAVIS
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P. O. BOX 655474
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M/S 3999
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DALLAS, TX 75265
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05/11/2024 11:33 AM
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